Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...
ASE Technology (NYSE:ASX) delivers semiconductor assembly, testing, and IC packaging services, supporting engineering, supply ...
As the semiconductor industry moves to smaller scales, it must overcome several technical challenges. In 2025, we expect three key developments to make headlines: Gate-All-Around transistor designs, ...
Every Wednesday and Friday, TechNode’s Briefing newsletter delivers a roundup of the most important news in China tech, straight to your inbox. Sign up Traditionally, packaging has been considered a ...
As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled applications-from ...
To navigate potential US sanctions on China’s chip industry, Chinese semiconductor design companies are forging collaborations with Malaysian chip packaging firms for the assembly of high-end graphics ...
A technical paper titled “US Microelectronics Packaging Ecosystem: Challenges and Opportunities” was published by researchers at University of Florida, University of Miami, and Skywater Technology ...
Malaysia stands at a pivotal moment. A crucial player in the global outsourced semiconductor assembly and test (OSAT) landscape, the nation now eyes transforming into a comprehensive semiconductor hub ...
Ensuring chip facilities have local supply chains and customers will decide whether India’s chip ambition becomes a costly ...
With a focus on transforming India into a semiconductor powerhouse, Tata Electronics, led by N Chandrasekaran, has committed ₹1.18 lakh crore to build a fabrication plant in Gujarat and an assembly ...
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