3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven ...

When you’re fighting off a threat, you typically want all the resistance you can muster. In IC design, on the other hand, minimizing resistance is crucial to success in power structure design. As ...

Synopsys DesignDash Autonomously Uncovers Untapped, Actionable Design Insights to Accelerate the IC Design Process The digital design flow holds a wealth of information from myriad sources that, ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog post. The latest ...

The need to move large quantities of data at high speeds continues to increase, pressuring component manufacturers to improve their technology and, simultaneously, to reduce costs. One of the key ...

Seldom does a design team receive carte blanche—at whatever the cost—to meet performance or power specifications. But given the partitioning and segmentation of many IC design flows, it’s not uncommon ...

If you want a graphic indication of how much the wall between SoC design and chip manufacturing has come down, take a look at SPIE. This conference, more formally SPIE Advanced Lithography 2008, has ...

Taiwan is an important hub of the global information and communication technology (ICT) industry. The development of the ICT supply chain is supported by Taiwan's complete semiconductor ecosystem.